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Rooting binder-free tin nanoarrays into copper substrate via tin-copper alloying for robust energy storage

Crossref DOI link: https://doi.org/10.1038/s41467-020-15045-x

Published Online: 2020-03-05

Update policy: https://doi.org/10.1007/springer_crossmark_policy

Authors

Ni, Jiangfeng https://orcid.org/0000-0002-1649-4282
Zhu, Xiaocui

Yuan, Yifei https://orcid.org/0000-0002-2360-8794
Wang, Zhenzhu

Li, Yingbo

Ma, Lu

Dai, Alvin

Li, Matthew https://orcid.org/0000-0001-9093-3207
Wu, Tianpin https://orcid.org/0000-0002-6226-6205
Shahbazian-Yassar, Reza https://orcid.org/0000-0002-7744-4780
Lu, Jun https://orcid.org/0000-0003-0858-8577
Li, Liang
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Text and Data Mining valid from 2020-03-05

Version of Record valid from 2020-03-05
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Article History

Received: 20 October 2019

Accepted: 12 February 2020

First Online: 5 March 2020

Competing interests

: The authors declare no competing interests.