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Wafer-scale platform for on-chip 3D radio frequency lumped passive components using metal self-rolled-up membrane technique

Crossref DOI link: https://doi.org/10.1038/s41467-025-57769-8

Published Online: 2025-03-13

Update policy: https://doi.org/10.1007/springer_crossmark_policy

Authors

Zhou, Zhikun https://orcid.org/0000-0003-0531-7317
Zhang, Zihan https://orcid.org/0009-0003-2712-4388
Zhang, Hanlin

Wei, Xianchao https://orcid.org/0009-0008-4161-2827
He, Wei

Shen, Quhuan

Bi, Xiuwen

Yuan, Tao https://orcid.org/0000-0002-9525-3814
Chen, Xiaochen https://orcid.org/0009-0000-0579-5226
Sang, Lei

Huang, Wen https://orcid.org/0000-0002-3331-1425
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Text and Data Mining valid from 2025-03-13

Version of Record valid from 2025-03-13
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Article History

Received: 27 March 2024

Accepted: 1 March 2025

First Online: 13 March 2025

Competing interests

: The authors declare no competing interests.