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Authors
Wang, Jian https://orcid.org/0000-0001-7187-1629
Zheng, Kaihuang
Liu, Tao
Liu, Hao
Cui, Hongdao
Li, Hang
Liang, Yucan
Zhou, Shaotong
Li, Fuhai
Wang, Da
Fan, Chunfeng
Shang, Jin
He, Qichao
Cheng, Yue
Jiang, Bo
Qi, Jialiang
Chang, Liqiang
Shuai, Wen
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Article History
Received: 22 May 2025
Accepted: 23 March 2026
First Online: 3 April 2026
Competing interests
: The authors declare the following competing interests: Two patent applications related to this work have been filed. First, a patent on the localized thermal activation 4D IM (Applicant: Beijing University of Chemical Technology; Inventors: J. Wang, W. Shuai; Application No.: 202512027996.6; Status: Pending; Territory: China) covering the apparatus and the method in Fig. 2. Second, a patent on selective in-mold bonding 4D IM (Applicant: Beijing University of Chemical Technology; Inventors: J. Wang, J. Qi; Application No.: 202512027988.1; Status: Pending; Territory: China) covering the apparatus and the method in Fig. 3. All other authors declare no competing interests.
