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High-throughput approach to explore cold metals for electronic and thermoelectric devices

Published Online: 2024-04-22

Authors

Zhang, Ligong

Liu, Fei https://orcid.org/0000-0003-3212-7594
Funding

Funding for this research was provided by:

National Science Foundation of China | National Natural Science Foundation of China-Yunnan Joint Fund (61974003)

National Science Foundation of China | National Natural Science Foundation of China-Yunnan Joint Fund (T2293700)

National Science Foundation of China | National Natural Science Foundation of China-Yunnan Joint Fund (T2293703)
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Text and Data Mining valid from 2024-04-22

Version of Record valid from 2024-04-22
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Article History

Received: 26 June 2023

Accepted: 10 April 2024

First Online: 22 April 2024

Competing interests

: The authors declare no competing interests.

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