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Room temperature compressed air-stable conductive copper films for flexible electronics

Crossref DOI link: https://doi.org/10.1038/s41528-024-00331-1

Published Online: 2024-07-27

Update policy: https://doi.org/10.1007/springer_crossmark_policy

Authors

Pereira, H. Jessica http://orcid.org/0000-0002-2883-4686
Makarovsky, Oleg http://orcid.org/0000-0002-8625-5084
Amabilino, David. B. http://orcid.org/0000-0003-1674-8462
Newton, Graham N. http://orcid.org/0000-0003-2246-4466
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Text and Data Mining valid from 2024-07-27

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Article History

Received: 14 December 2023

Accepted: 19 July 2024

First Online: 27 July 2024

Competing interests

: The authors declare no competing interests.