Langowski, Mark D.
Khan, Farhat A.
Savransky, Sofya
Brown, Dallas R.
Balasubramaniyam, Arasu
Harrison, William B.
Zou, Xiaoyan
Beck, Zoltan
Matyas, Gary R. http://orcid.org/0000-0002-2074-2373
Regules, Jason A.
Miller, Robin
Soisson, Lorraine A.
Batchelor, Adrian H.
Dutta, Sheetij http://orcid.org/0000-0002-4571-1880
Funding for this research was provided by:
U.S. Department of Defense (MIDRP)
USAID and US DoD
US DoD, USAID
Article History
Received: 24 March 2021
Accepted: 14 December 2021
First Online: 27 January 2022
Competing interests
: The authors S.D., A.B., F.K., and M.L. have filed a patent for the TMV particle technology. The material has been reviewed by the Walter Reed Army Institute of Research and the US Agency for International Development. There is no objection to its presentation and/or publication. The opinions or assertions contained herein are the private views of the author and are not to be construed as official, or as reflecting true views of the Department of the Army, the Department of Defense, or the US Agency for International Development.