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Authors
Kim, Jin http://orcid.org/0000-0002-7667-9588
Lee, Kyung-Tae http://orcid.org/0000-0002-0068-6220
Lee, Jong Seung
Shin, Jisoo
Cui, Baofang
Yang, Kisuk
Choi, Yi Sun http://orcid.org/0000-0002-4691-8875
Choi, Nakwon http://orcid.org/0000-0003-2993-9233
Lee, Soo Hyun
Lee, Jae-Hyun http://orcid.org/0000-0002-9236-157X
Bahn, Yong-Sun http://orcid.org/0000-0001-9573-5752
Cho, Seung-Woo http://orcid.org/0000-0001-8058-332X
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Funding
Funding for this research was provided by:
National Research Foundation of Korea (2017M3C7A1047659, 2016R1E1A1A01943365, 2017M3C7A1047659, 2017M3C7A1047659, 2017M3C7A1047659, 2021R1A2C3004262, 2016R1E1A1A01943365, 2018R1A5A1025077, 2017M3C7A1047659, 2021R1A2C3004262)
Ministry of Trade, Industry and Energy, Korea | Korea Evaluation Institute of Industrial Technology (20009125, 20009125)
Institute for Basic Science
Ministry of Agriculture, Food and Rural Affairs (916006-2)
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Article History
Received: 8 October 2019
Accepted: 30 April 2021
First Online: 14 June 2021
Competing interests
: J.K., K.-T.L., Y.-S.B. and S.-W.C. are co-inventors on patent applications (Korean Patent 10-2019-0115272, US patent 17/277,640 and EP patent 19 863 762.1) related to the hNVU chip developed in the manuscript.
