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Authors
Chen, Zhen https://orcid.org/0000-0003-3355-3464
Turgut, Emrah
Jiang, Yi https://orcid.org/0000-0002-2807-1324
Nguyen, Kayla X.
Stolt, Matthew J.
Jin, Song https://orcid.org/0000-0001-8693-7010
Ralph, Daniel C. https://orcid.org/0000-0002-3026-0335
Fuchs, Gregory D. https://orcid.org/0000-0003-4343-8523
Muller, David A. https://orcid.org/0000-0003-4129-0473
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Funding
Funding for this research was provided by:
NSF | ENG/OAD | Division of Electrical, Communications and Cyber Systems (ECCS-1609585)
United States Department of Defense | Defense Advanced Research Projects Agency (TEE-D18AC00009)
NSF | Directorate for Mathematical & Physical Sciences | Division of Materials Research (DMR-2039380)
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Article History
Received: 9 November 2021
Accepted: 5 September 2022
First Online: 31 October 2022
Competing interests
: Cornell University has licensed the EMPAD hardware to Thermo Scientific (D.M. and K.X.N. each receives 4.4% of the license fee).
