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Multi-project wafers for flexible thin-film electronics by independent foundries

Crossref DOI link: https://doi.org/10.1038/s41586-024-07306-2

Published Online: 2024-04-24

Published Print: 2024-05-09

Update policy: https://doi.org/10.1007/springer_crossmark_policy

Authors

Çeliker, Hikmet https://orcid.org/0000-0001-8429-0153
Dehaene, Wim

Myny, Kris https://orcid.org/0000-0002-5230-495X
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Text and Data Mining valid from 2024-04-24

Version of Record valid from 2024-04-24
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Article History

Received: 30 June 2023

Accepted: 13 March 2024

First Online: 24 April 2024

Competing interests

: The authors declare no competing interests.