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Manipulating the adhesion of electroless nickel-phosphorus film on silicon wafers by silane compound modification and rapid thermal annealing

Published Online: 2017-08-29

Authors

Hsu, Chin-Wei

Wang, Wei-Yen

Wang, Kuan-Ting

Chen, Hou-An

Wei, Tzu-Chien
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Text and Data Mining valid from 2017-08-29

Version of Record valid from 2017-08-29
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Article History

Received: 12 April 2017

Accepted: 12 July 2017

First Online: 29 August 2017

Competing Interests

: The authors declare that they have no competing interests.

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