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Growth kinetics of Cu6Sn5 intermetallic compound in Cu-liquid Sn interfacial reaction enhanced by electric current

Published Online: 2018-01-29

Authors

Feng, Jiayun

Hang, Chunjin

Tian, Yanhong

Liu, Baolei

Wang, Chenxi
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Text and Data Mining valid from 2018-01-29

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Article History

Received: 2 November 2017

Accepted: 10 January 2018

First Online: 29 January 2018

Competing Interests

: The authors declare that they have no competing interests.

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