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Reliable low-temperature die attach process using Ag/Sn/Ag sandwich structure for high-temperature semiconductor devices

Published Online: 2019-01-24

Authors

Choi, Jinseok

Choi, Gab Soo

An, Sung Jin https://orcid.org/0000-0002-5114-1933
Funding

Funding for this research was provided by:

National Research Foundation of Korea (2018R1D1A1B07050766, 2014R1A1A4A01009268, 2018R1A6A1A03025761)

Ministry of Science, ICT and Future Planning (IITP-2018-2014-1-00639)
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Text and Data Mining valid from 2019-01-24

Version of Record valid from 2019-01-24
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Article History

Received: 23 August 2018

Accepted: 3 December 2018

First Online: 24 January 2019

Competing Interests

: The authors declare no competing interests.

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