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Suppressed Growth of (Fe, Cr, Co, Ni, Cu)Sn2 Intermetallic Compound at Interface between Sn-3.0Ag-0.5Cu Solder and FeCoNiCrCu0.5 Substrate during Solid-state Aging

Crossref DOI link: https://doi.org/10.1038/s41598-019-46757-w

Published Online: 2019-07-15

Update policy: https://doi.org/10.1007/springer_crossmark_policy

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