Document is current

Any future updates will be listed below

Solid-state bonding behavior between surface-nanostructured Cu and Au: a molecular dynamics simulation

Crossref DOI link: https://doi.org/10.1038/s41598-022-17119-w

Published Online: 2022-07-26

Update policy: https://doi.org/10.1007/springer_crossmark_policy

About CrossMark