Retraction Note: Enhanced tensile strength and thermal conductivity in copper diamond composites with B4C coating
Crossref DOI link: https://doi.org/10.1038/s41598-022-25431-8
Published Online: 2022-12-06
Update policy: https://doi.org/10.1007/springer_crossmark_policy
Sun, Youhong
He, Linkai
Zhang, Chi
Meng, Qingnan
Liu, Baochang
Gao, Ke
Wen, Mao
Zheng, Weitao
Text and Data Mining valid from 2022-12-06
Version of Record valid from 2022-12-06
Article History
First Online: 6 December 2022