Sidewall patterning of organic–inorganic multilayer thin film encapsulation by adhesion lithography
Crossref DOI link: https://doi.org/10.1038/s41598-023-39155-w
Published Online: 2023-07-31
Update policy: https://doi.org/10.1007/springer_crossmark_policy
Lee, Seung Woo
Cho, Heyjin
Jang, Choel-Min
Huh, Myung-Soo
Cho, Sung Min
Text and Data Mining valid from 2023-07-31
Version of Record valid from 2023-07-31
Article History
Received: 11 April 2023
Accepted: 20 July 2023
First Online: 31 July 2023
Competing interests
: The authors declare no competing interests.