Cılasun, Hüsrev
Zeng, Ziqing
S, Ramprasath
Kumar, Abhimanyu
Lo, Hao
Cho, William
Moy, William
Kim, Chris H.
Karpuzcu, Ulya R.
Sapatnekar, Sachin S.
Funding for this research was provided by:
Defense Advanced Research Projects Agency (FA8750-22-C-1034, FA8750-22-C-1034, FA8750-22-C-1034, FA8750-22-C-1034, FA8750-22-C-1034, FA8750-22-C-1034, FA8750-22-C-1034, FA8750-22-C-1034, FA8750-22-C-1034, FA8750-22-C-1034)
National Science Foundation (2230963, 2230963, 2230963, 2230963, 2230963, 2230963, 2230963, 2230963, 2230963, 2230963)
Intel (Transformative Hardware for AI (THWAI), Transformative Hardware for AI (THWAI), Transformative Hardware for AI (THWAI), Transformative Hardware for AI (THWAI))
Article History
Received: 6 February 2024
Accepted: 21 April 2024
First Online: 10 May 2024
Declarations
:
: C.K. is the founder of Leviosa Technologies, LLC. C.K., W.M., and H.L. are inventors of US patent 11,888,484 that covers the architecture aspects of the chip.