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An investigation of methods to enhance adhesion of conductive layer and dielectric substrate for additive manufacturing of electronics

Published Online: 2024-05-06

Authors

Xu, Zhiguang

Hui, Jizhuang

Lv, Jingxiang

Wei, Dongjie

Yan, Zhiqiang

Zhang, Hao

Wang, Junjie
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Text and Data Mining valid from 2024-05-06

Version of Record valid from 2024-05-06
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Article History

Received: 6 January 2024

Accepted: 3 May 2024

First Online: 6 May 2024

Competing interests

: The authors declare no competing interests.

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