Peria, William K.
Katz, Michael B.
Wang, Jian-Ping
Crowell, Paul A.
Gopman, Daniel B.
Funding for this research was provided by:
United States Department of Commerce | National Institute of Standards and Technology
Semiconductor Research Corporation
National Science Foundation (DMR-2011401, ECCS-2025124)
Article History
Received: 26 May 2023
Accepted: 29 May 2024
First Online: 10 June 2024
Competing interests
: The authors declare no competing interests.