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Authors
Chen, Wenbin
Wang, Zheng
Zhao, Hongchao
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Funding
Funding for this research was provided by:
School-level project of Chongqing University of Science and Technology (ckrc2020009)
the Science and Technology Research Program Project of Chongqing Municipal Education Commission (KJZD-K202203601)
Deep Learning Based Online Detection of Assembly Defects in Printed Circuit Board Components (19230101029, 19230101029, 19230101029)
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Article History
Received: 12 March 2024
Accepted: 13 August 2024
First Online: 27 August 2024
Competing interests
: The authors declare no competing interests.
