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Authors
Chen, Wenbin
Wang, Zheng
Zhao, Hongchao
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Funding
Funding for this research was provided by:
School-level project of Chongqing University of Science and Technology (ckrc2020009)
the Science and Technology Research Program Project of Chongqing Municipal Education Commission (KJZD-K202203601)
Deep Learning Based Online Detection of Assembly Defects in Printed Circuit Board Components (19230101029)
Deep Learning Based Online Detection of Assembly Defects in Printed Circuit Board Components (19230101029)
Deep Learning Based Online Detection of Assembly Defects in Printed Circuit Board Components (19230101029)
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Article History
Received: 12 March 2024
Accepted: 13 August 2024
First Online: 27 August 2024
Competing interests
: The authors declare no competing interests.
