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Authors
Cheng, Ming-Chung
Lu, Hai-Han
Lin, Hsiao-Mei
Hayle, Stotaw Talbachew
Huang, Xu-Hong
Hsu, Wei-Wen
Chung, Yu-Chen
Bai, Yu-Yao
Okram, Kelper
Lu, Jia-Ming
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Funding
Funding for this research was provided by:
National Science and Technology Council (111-2221-E-027-031-MY3, 111-2221-E-027-031-MY3, 111-2221-E-027-031-MY3, 111-2221-E-027-031-MY3, 111-2221-E-027-031-MY3, 111-2221-E-027-031-MY3, 111-2221-E-027-031-MY3)
Hsinchu Science Park Emerging Technology Application Program (112AO02B, 112AO02B, 112AO02B, 112AO02B, 112AO02B)
Qualcomm Technologies, Inc. (NAT-514839, NAT-514839, NAT-514839, NAT-514839, NAT-514839)
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Article History
Received: 24 August 2024
Accepted: 28 October 2024
First Online: 2 November 2024
Declarations
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: The authors declare no competing interests.
