CTE match of copper foil and build-up film/core board in FCBGA substrate reduces warpage
Crossref DOI link: https://doi.org/10.1038/s41598-025-25232-9
Published Online: 2025-11-21
Update policy: https://doi.org/10.1007/springer_crossmark_policy
Wong, Winston
Chiang, S. T.
Huang, Jason C. S.
Zhou, X. D.
Text and Data Mining valid from 2025-11-21
Version of Record valid from 2025-11-21
Article History
Received: 14 July 2025
Accepted: 18 October 2025
First Online: 21 November 2025
Declarations
:
: The authors declare no competing interests.