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Development and characterization of carbon-based conductive pastes with high mechanical integrity under bending stress for room-temperature printable electronics

Crossref DOI link: https://doi.org/10.1038/s41598-025-90210-0

Published Online: 2025-02-21

Update policy: https://doi.org/10.1007/springer_crossmark_policy

Authors

Mesa, Santiago

Ramírez, Edwin

Rivera Botia, Kelly G.

Jaramillo, Franklin

Ramírez, Daniel
Funding

Funding for this research was provided by:

Sistema General de Regalías de Colombia (2022000100089)

Sistema General de Regalías de Colombia (2022000100089)

Sistema General de Regalías de Colombia (2022000100089)

Sistema General de Regalías de Colombia (2022000100089)

Sistema General de Regalías de Colombia (2022000100089)
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Text and Data Mining valid from 2025-02-21

Version of Record valid from 2025-02-21
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Article History

Received: 8 November 2024

Accepted: 11 February 2025

First Online: 21 February 2025

Declarations

:

: The authors declare no competing interests.

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