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Development and characterization of carbon-based conductive pastes with high mechanical integrity under bending stress for room-temperature printable electronics

Crossref DOI link: https://doi.org/10.1038/s41598-025-90210-0

Published Online: 2025-02-21

Update policy: https://doi.org/10.1007/springer_crossmark_policy

Authors

Mesa, Santiago

Ramírez, Edwin

Rivera Botia, Kelly G.

Jaramillo, Franklin

Ramírez, Daniel
Funding

Funding for this research was provided by:

Sistema General de Regalías de Colombia (2022000100089, 2022000100089, 2022000100089, 2022000100089, 2022000100089)
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Text and Data Mining valid from 2025-02-21

Version of Record valid from 2025-02-21
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Article History

Received: 8 November 2024

Accepted: 11 February 2025

First Online: 21 February 2025

Declarations

:

: The authors declare no competing interests.

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