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Optimization mechanism of laminated ceramic package structure on the regulation of semiconductor cooling performance

Published Online: 2025-04-26

Authors

Yan, Shifeng

Zhao, Qian

Wang, Faxiang

Bai, Yurun

Liu, Tianxiang

Guo, Wenzhong

Zhang, Changfu
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Text and Data Mining valid from 2025-04-26

Version of Record valid from 2025-04-26
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Article History

Received: 6 January 2025

Accepted: 9 April 2025

First Online: 26 April 2025

Declarations

:

: The authors declare no competing interests.

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