Enhancing uniformity in HARC etching via edge bias voltage and structural impedance variations in a rectangular voltage waveform
Crossref DOI link: https://doi.org/10.1038/s41598-026-36323-6
Published Online: 2026-01-20
Update policy: https://doi.org/10.1007/springer_crossmark_policy
Park, Chanho
Cho, Jinill
Um, Junghwan
Kim, Taesung
Text and Data Mining valid from 2026-01-20
Version of Record valid from 2026-02-11
Article History
Received: 8 July 2025
Accepted: 12 January 2026
First Online: 20 January 2026
Declarations
:
: The authors declare no competing interests.