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Performance enhancement of a wavy microchannel heat sink by geometric modification and porous copper foam integration

Published Online: 2026-07-04

Authors

Jafari, Bahram

Hosseinzadeh, Khashayar

Mehrzad, Ali

Mohammadzadeh, A. M.
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Text and Data Mining valid from 2026-07-04

Accepted Manuscript valid from 2026-07-04
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Article History

Received: 12 April 2026

Accepted: 1 July 2026

First Online: 4 July 2026

Competing interests

: The authors declare no competing interests.

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