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Copper-graphene heterostructure for back-end-of-line compatible high-performance interconnects

Crossref DOI link: https://doi.org/10.1038/s41699-021-00216-1

Published Online: 2021-04-12

Update policy: https://doi.org/10.1007/springer_crossmark_policy

Authors

Son, Myungwoo https://orcid.org/0000-0002-5854-6386
Jang, Jaewon https://orcid.org/0000-0002-8128-3414
Lee, Yongsu

Nam, Jungtae

Hwang, Jun Yeon

Kim, In S. https://orcid.org/0000-0002-6016-5267
Lee, Byoung Hun https://orcid.org/0000-0002-4540-7731
Ham, Moon-Ho

Chee, Sang-Soo https://orcid.org/0000-0001-9111-3358
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Text and Data Mining valid from 2021-04-12

Version of Record valid from 2021-04-12
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Article History

Received: 18 July 2020

Accepted: 9 March 2021

First Online: 12 April 2021

Competing interests

: The authors declare no competing interests.