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Advanced packaging of chiplets for future computing needs

Crossref DOI link: https://doi.org/10.1038/s41928-024-01175-3

Published Online: 2024-06-27

Update policy: https://doi.org/10.1007/springer_crossmark_policy

Authors

Das Sharma, Debendra http://orcid.org/0000-0003-1530-7788
Mahajan, Ravi V. http://orcid.org/0000-0003-2562-359X
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Text and Data Mining valid from 2024-06-27

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Article History

First Online: 27 June 2024

Competing interests

: The authors declare no competing interests.