Crossmark

Building 3D integrated circuits with electronics and photonics

Crossref DOI link: https://doi.org/10.1038/s41928-024-01187-z

Published Online: 2024-06-27

Update policy: https://doi.org/10.1007/springer_crossmark_policy

Authors

Xiang, Chao http://orcid.org/0000-0002-7081-0346
Bowers, John E.
License Information

Text and Data Mining valid from 2024-06-27

Version of Record valid from 2024-06-27
More Information

Article History

First Online: 27 June 2024

Competing interests

: The authors declare no competing interests.