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Rapid interconnects for 3D soft electronics

Crossref DOI link: https://doi.org/10.1038/s41928-024-01282-1

Published Online: 2024-11-11

Update policy: https://doi.org/10.1007/springer_crossmark_policy

Authors

Babatain, Wedyan https://orcid.org/0000-0001-7526-5749
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Article History

First Online: 11 November 2024

Competing interests

: The author declares no competing interests.