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Fast in-line failure analysis of sub-micron-sized cracks in 3D interconnect technologies utilizing acoustic interferometry

Crossref DOI link: https://doi.org/10.1038/s44172-024-00247-8

Published Online: 2024-07-19

Update policy: https://doi.org/10.1007/springer_crossmark_policy

Authors

Paulachan, Priya http://orcid.org/0009-0009-3629-0584
Hammer, René

Siegert, Joerg

Wiesler, Ingo

Brunner, Roland http://orcid.org/0000-0002-0079-3288
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Text and Data Mining valid from 2024-07-19

Version of Record valid from 2024-07-19
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Article History

Received: 16 November 2023

Accepted: 4 July 2024

First Online: 19 July 2024

Competing interests

: The authors declare no competing interests.