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Thermal management of 3-D heterogeneously integrated microelectronics: challenges and future research directions

Crossref DOI link: https://doi.org/10.1038/s44172-026-00590-y

Published Online: 2026-02-11

Update policy: https://doi.org/10.1007/springer_crossmark_policy

Authors

Sharma, Manoj Kumar https://orcid.org/0000-0002-9456-3685
Ramos-Alvarado, Bladimir
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Text and Data Mining valid from 2026-02-11

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Article History

Received: 27 June 2025

Accepted: 13 January 2026

First Online: 11 February 2026

Competing interests

: The authors declare no competing interests.