Wafer-to-wafer hybrid bonding at 400-nm interconnect pitch
Crossref DOI link: https://doi.org/10.1038/s44287-024-00019-8
Published Online: 2024-02-16
Update policy: https://doi.org/10.1007/springer_crossmark_policy
Chew, Soon Aik
De Vos, Joeri
Beyne, Eric
Text and Data Mining valid from 2024-02-16
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Article History
First Online: 16 February 2024
Competing interests
: The authors declare no competing interests.