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Europe’s pilot line for advanced packaging and heterogeneous integration of electronic components and systems (APECS)

Crossref DOI link: https://doi.org/10.1038/s44287-024-00134-6

Published Online: 2025-01-02

Update policy: https://doi.org/10.1007/springer_crossmark_policy

Authors

Bressler, Patrick R.

Töpper, Michael

Ramm, Peter
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Article History

First Online: 2 January 2025

Competing interests

: The authors declare no competing interests.