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The use of polyimide-modified aluminum nitride fillers in AlN@PI/Epoxy composites with enhanced thermal conductivity for electronic encapsulation

Published Online: 2014-04-24

Authors

Zhou, Yongcun

Yao, Yagang

Chen, Chia-Yun

Moon, Kyoungsik

Wang, Hong

Wong, Ching-ping
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Text and Data Mining valid from 2014-04-24

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Article History

Received: 29 November 2013

Accepted: 7 April 2014

First Online: 24 April 2014

Competing interests

: The authors declare no competing financial interests.

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