Hierarchical Assembly of a Dual-responsive Macroscopic Insulated Molecular Wire Bundle in a Gradient System
Crossref DOI link: https://doi.org/10.1038/srep07791
Published Online: 2015-01-15
Update policy: https://doi.org/10.1007/springer_crossmark_policy
Sheng, Yujie
Chen, Qibin
Yao, Junyao
Wang, Ying
Liu, Honglai
Text and Data Mining valid from 2015-01-15
Version of Record valid from 2015-01-15
Article History
Received: 4 August 2014
Accepted: 16 December 2014
First Online: 15 January 2015
Competing interests
: The authors declare no competing financial interests.