Growth kinetics of Cu6Sn5 intermetallic compound at liquid-solid interfaces in Cu/Sn/Cu interconnects under temperature gradient
Crossref DOI link: https://doi.org/10.1038/srep13491
Published Online: 2015-08-27
Update policy: https://doi.org/10.1007/springer_crossmark_policy
Zhao, N.
Zhong, Y.
Huang, M.L.
Ma, H.T.
Dong, W.
Text and Data Mining valid from 2015-08-27
Version of Record valid from 2015-08-27
Article History
Received: 26 February 2015
Accepted: 27 July 2015
First Online: 27 August 2015
Competing interests
: The authors declare no competing financial interests.