A novel approach of chemical mechanical polishing using environment-friendly slurry for mercury cadmium telluride semiconductors
Crossref DOI link: https://doi.org/10.1038/srep22466
Published Online: 2016-03-01
Update policy: https://doi.org/10.1007/springer_crossmark_policy
Zhang, Zhenyu
Wang, Bo
Zhou, Ping
Guo, Dongming
Kang, Renke
Zhang, Bi
Text and Data Mining valid from 2016-03-01
Version of Record valid from 2016-03-01
Article History
Received: 8 January 2016
Accepted: 15 February 2016
First Online: 1 March 2016
Competing interests
: The authors declare no competing financial interests.