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Fast formation and growth of high-density Sn whiskers in Mg/Sn-based solder/Mg joints by ultrasonic-assisted soldering: Phenomena, mechanism and prevention

Crossref DOI link: https://doi.org/10.1038/srep27522

Published Online: 2016-06-08

Update policy: https://doi.org/10.1007/springer_crossmark_policy

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