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Electrochemical deposition of layered copper thin films based on the diffusion limited aggregation

Published Online: 2016-10-13

Authors

Wei, Chenhuinan

Wu, Guoxing

Yang, Sanjun

Liu, Qiming
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Text and Data Mining valid from 2016-10-13

Version of Record valid from 2016-10-13
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Article History

Received: 25 May 2016

Accepted: 19 September 2016

First Online: 13 October 2016

Competing interests

: The authors declare no competing financial interests.

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