Ma, Z. L. http://orcid.org/0000-0003-0769-7587
Belyakov, S. A.
Sweatman, K.
Nishimura, T.
Nishimura, T.
Gourlay, C. M.
Article History
Received: 18 July 2017
Accepted: 11 October 2017
First Online: 4 December 2017
Competing interests
: The authors are co-inventors on a patent entitled “Solder joint and bonding method”, Japanese patent number: 2017-133073.