Yan, Xiaodong http://orcid.org/0000-0002-7737-6984
Ma, Jiahui
Wu, Tong http://orcid.org/0000-0001-6018-0283
Zhang, Aoyang
Wu, Jiangbin http://orcid.org/0000-0002-8751-7082
Chin, Matthew
Zhang, Zhihan
Dubey, Madan
Wu, Wei http://orcid.org/0000-0001-6404-0317
Chen, Mike Shuo-Wei
Guo, Jing http://orcid.org/0000-0003-4009-3056
Wang, Han http://orcid.org/0000-0001-5121-3362
Funding for this research was provided by:
United States Department of Defense | United States Army | U.S. Army Research, Development and Engineering Command | Army Research Office
Article History
Received: 9 January 2021
Accepted: 9 September 2021
First Online: 29 September 2021
Competing interests
: The authors declare the following competing interests: H.W. currently also leads the low-dimensional materials research at Taiwan Semiconductor Manufacturing Company (TSMC) Corporate Research. All other authors declare no competing interests.