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Authors
Wang, Jia http://orcid.org/0000-0001-7025-6464
Cai, Wentao http://orcid.org/0000-0001-5789-5421
Lu, Weifang http://orcid.org/0000-0001-6214-4024
Lu, Shun
Kano, Emi
Agulto, Verdad C. http://orcid.org/0000-0002-5408-5148
Sarkar, Biplab http://orcid.org/0000-0003-0074-0626
Watanabe, Hirotaka
Ikarashi, Nobuyuki
Iwamoto, Toshiyuki
Nakajima, Makoto
Honda, Yoshio
Amano, Hiroshi http://orcid.org/0000-0002-7598-2593
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Article History
Received: 4 February 2022
Accepted: 2 May 2024
First Online: 5 June 2024
Competing interests
: J.W. and H.A. have filed a patent application directly related to the content of this paper (application number: 2023-011149; application date: 27 January 2023; title of invention: ‘Semiconductor device and method for manufacturing semiconductor device’). The authors acknowledge that this constitutes a potential competing interest and have fully disclosed the nature of this interest in accordance with the relevant policies. The other authors declare no competing interests.
