Degradation kinetics of Ti-Cu compound layer in transient liquid phase bonded graphite/copper joints
Crossref DOI link: https://doi.org/10.1038/s41598-018-33446-3
Published Online: 2018-10-12
Update policy: https://doi.org/10.1007/springer_crossmark_policy
Lin, Jincheng
Huang, Mei
Yang, Weiqi
Xing, Lili
Text and Data Mining valid from 2018-10-12
Version of Record valid from 2018-10-12
Article History
Received: 16 April 2018
Accepted: 28 September 2018
First Online: 12 October 2018
Competing Interests
: The authors declare no competing interests.