Multilayer Substrate to Use Brittle Materials in Flexible Electronics
Crossref DOI link: https://doi.org/10.1038/s41598-020-64057-6
Published Online: 2020-05-06
Update policy: https://doi.org/10.1007/springer_crossmark_policy
Park, Seongmin
Park, Hyuk
Seong, Suwon
Chung, Yoonyoung
Text and Data Mining valid from 2020-05-06
Version of Record valid from 2020-05-06
Article History
Received: 3 January 2020
Accepted: 9 April 2020
First Online: 6 May 2020
Competing interests
: The authors declare no competing interests.