Author Correction: Effect of FeCoNiCrCu0.5 High-entropy-alloy Substrate on Sn Grain Size in Sn-3.0Ag-0.5Cu Solder
Crossref DOI link: https://doi.org/10.1038/s41598-020-67126-y
Published Online: 2020-07-22
Update policy: https://doi.org/10.1007/springer_crossmark_policy
Shen, Yu-An
Lin, Chun-Ming
Li, Jiahui
He, Siliang
Nishikawa, Hiroshi
Text and Data Mining valid from 2020-07-22
Version of Record valid from 2020-07-22
Article History
First Online: 22 July 2020