Study on electroless Cu plating quality of in situ TiCp
Crossref DOI link: https://doi.org/10.1038/s41598-020-69105-9
Published Online: 2020-07-22
Update policy: https://doi.org/10.1007/springer_crossmark_policy
Zhang, Dongdong
Liu, Yu
Gao, Yali
Wang, Jinguo
Text and Data Mining valid from 2020-07-22
Version of Record valid from 2020-07-22
Article History
Received: 4 November 2019
Accepted: 7 July 2020
First Online: 22 July 2020
Competing interests
: The authors declare no competing interest.