Kimura, Mutsumi
Shibayama, Yuki
Nakashima, Yasuhiko
Funding for this research was provided by:
KAKENHI (19K11876)
Yazaki Memorial Foundation for Science and Technology
Support Center for Advanced Telecommunications Technology Research
Research Grants in the Natural Sciences from the Mitsubishi Foundation
The Telecommunications Advancement Foundation
Collaborative Research Project in Laboratory for Materials and Structures in Tokyo Institute of Technology
RIEC Nation-wide Cooperative Research Projects
ROHM Semiconductor
KOA Corporation
VDEC, the University of Tokyo with the collaboration by Rohm Corporation and Toppan Printing Corporation
Article History
Received: 26 December 2021
Accepted: 14 March 2022
First Online: 30 March 2022
Competing interests
: The authors declare no competing interests.