Size effect model on kinetics of interfacial reaction between Sn-xAg-yCu solders and Cu substrate
Crossref DOI link: https://doi.org/10.1038/srep07117
Published Online: 2014-11-19
Update policy: https://doi.org/10.1007/springer_crossmark_policy
Huang, M. L.
Yang, F.
Text and Data Mining valid from 2014-11-19
Version of Record valid from 2014-11-19
Article History
Received: 13 August 2014
Accepted: 3 November 2014
First Online: 19 November 2014
Competing interests
: The authors declare no competing financial interests.