A multi-class IC package type classifier based on kernel-based nonlinear LS-SVM method
Crossref DOI link: https://doi.org/10.1080/18756891.2014.892265
Published Online: 2014
Update policy: https://doi.org/10.1080/tandf_crossmark_01
Hung, Yung-Hsiang
Huang, Mei-Ling
Peer Review Statement: The publishing and review policy for this title is described in its Aims & Scope.
Aim & Scope: http://www.tandfonline.com/action/journalInformation?show=aimsScope&journalCode=tcis20